PIC Packager

The Role

As a Photonic Integrated Circuit (PIC) Packaging Engineer, you’ll play a key role in developing advanced packaging and integration solutions for next-generation photonic devices. Working alongside device, process, test and systems engineers, you’ll help bring innovative photonic technologies from development through qualification and commercial deployment.

This position offers the opportunity to solve complex challenges at the intersection of photonics, packaging and manufacturing while contributing to cutting-edge optical systems.

What You’ll Do

• Develop packaging and integration solutions for photonic integrated circuits, optoelectronic devices and advanced optical modules.
• Design and optimise assembly processes including optical alignment, fibre attachment, die bonding and photonic device integration.
• Collaborate with design, fabrication and test teams to ensure successful device performance and manufacturability.
• Support prototype builds, product qualification and transition into low- and high-volume manufacturing.
• Develop packaging architectures that balance optical performance, thermal management, mechanical stability and reliability.
• Work with external manufacturing and assembly partners to support product development and scaling.
• Investigate and resolve packaging, assembly and yield-related challenges through data-driven analysis and experimentation.

What We’re Looking For

• Bachelor’s, Master’s or PhD in Photonics, Mechanical Engineering, Electrical Engineering, Materials Science or a related field.
• Experience developing packaging solutions for photonic, optoelectronic or semiconductor-based products.
• Strong understanding of optical alignment, fibre coupling and precision assembly techniques.
• Experience with die attach, wire bonding, flip-chip integration or related microelectronics packaging processes.
• Knowledge of thermal, mechanical and reliability considerations for advanced photonic devices.
• Experience supporting product development from prototype through qualification and manufacturing.
• Strong problem-solving skills and ability to work within multidisciplinary engineering teams.

Nice to Have

• Experience packaging silicon photonics, quantum photonic devices, lasers, detectors or optical sensing systems.
• Familiarity with cryogenic packaging, quantum hardware or advanced photonic integration techniques.
• Experience with automated alignment systems and high-precision assembly equipment.
• Knowledge of reliability testing, environmental qualification and failure analysis methodologies.
• Python, MATLAB or similar tools for data analysis and process optimisation.
• Experience working with external foundries, packaging vendors or contract manufacturing partners.

Darwin Recruitment is acting as an Employment Agency in relation to this vacancy.

Oliver Logan